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stk14c88-5 256 kbit (32k x 8) autostore nvsram cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document number: 001-51038 rev. ** revised march 02, 2009 features 35 ns and 45 ns access times hands off automatic store on power down with external 68 f capacitor store to quantumtrap? nonvolatile elements is initiated by software, hardware, or autostore? on power down recall to sram initiated by software or power up unlimited read, write, and recall cycles 1,000,000 store cycl es to quantumtrap 100 year data retention to quantumtrap single 5v+ 10% operation military temperature 32-pin (300 mil) cdip and lcc (450 mil) packages functional description the cypress stk14c88-5 is a fast static ram with a nonvolatile element in each memory cell. the embedded nonvolatile elements incorporate quantumtrap technology producing the world?s most reliable nonvolatile memory. the sram provides unlimited read and write cycles , while independent, nonvolatile data resides in the highly reliable quantumtrap cell. data transfers from the sram to the nonvolatile elements (the store operation) takes place automatically at power down. on power up, data is restored to the sram (the recall operation) from the nonvolatile memory. both the store and recall operations are also available under software control. a hardware store is initiated with the hsb pin. store/ recall control power control software detect static ram array 512 x 512 quantum trap 512 x 512 store recall column i/o column dec row decoder input buffers oe ce we hsb v cc v cap a 13 - a 0 a 0 a 1 a 2 a 3 a 4 a 10 a 5 a 6 a 7 a 8 a 9 a 11 a 12 a 13 a 14 dq 0 dq 1 dq 2 dq 3 dq 4 dq 5 dq 6 dq 7 logic block diagram [+] feedback
stk14c88-5 document number: 001-51038 rev. ** page 2 of 17 pin configurations pin definitions pin name alt io type description a 0 ?a 14 input address inputs . used to select one of the 32,768 bytes of the nvsram. dq 0 -dq 7 input or output bidirectional data io lines . used as input or output lines depending on operation. we w input write enable input, active low . when the chip is enabled and we is low, data on the io pins is written to the specific address location. ce e input chip enable input, active low . when low, selects the chip. when high, deselects the chip. oe g input output enable, active low . the active low oe input enables the data output buffers during read cycles. deasserting oe high causes the io pins to tri-state. v ss ground ground for the device . the device is connected to ground of the system. v cc power supply power supply inputs to the device . hsb input or output hardware store busy (hsb ) . when low, this output indicates a hardware store is in progress. when pulled low external to the chip, it initiate s a nonvolatile store operation. a weak internal pull up resistor keeps this pin high if not connected (connection optional). v cap power supply autostore capacitor . supplies power to nvsram during power loss to store data from sram to nonvolatile elements. figure 1. pin diagram: 32-pin dip figure 2. pin diagram: 32-pin lcc [+] feedback stk14c88-5 document number: 001-51038 rev. ** page 3 of 17 device operation the stk14c88-5 nvsram is made up of two functional compo- nents paired in the same physical cell. these are an sram memory cell and a nonvolatile quantumtrap cell. the sram memory cell operates as a standard fast static ram. data in the sram is transferred to the nonvolatile cell (the store operation) or from the nonvolatile cell to sram (the recall operation). this unique arch itecture enables the storage and recall of all cells in parallel. during the store and recall operations, sram read and write operations are inhibited. the stk14c88-5 supports unlimit ed reads and writes similar to a typical sram. in addition, it provides unlimited recall opera- tions from the nonvolatile cells and up to one million store operations. sram read the stk14c88-5 performs a read cycle whenever ce and oe are low while we and hsb are high. the address specified on pins a 0?14 determines the 32,768 data bytes accessed. when the read is initiated by an ad dress transition, the outputs are valid after a delay of t aa (read cycle 1). if the read is initiated by ce or oe , the outputs are valid at t ace or at t doe , whichever is later (read cycle 2). the data outputs repeatedly respond to address changes within the t aa access time without the need for transitions on any control input pins, and remains valid until another address change or until ce or oe is brought high, or we or hsb is brought low. sram write a write cycle is performed whenever ce and we are low and hsb is high. the address inputs must be stable prior to entering the write cycle and must rema in stable until either ce or we goes high at the en d of the cycle. the data on the common io pins dq 0?7 are written into the me mory if it has valid t sd , before the end of a we controlled write or before the end of an ce controlled write. keep oe high during the entire write cycle to avoid data bus contention on common io lines. if oe is left low, internal circuitry turns off the output buffers t hzwe after we goes low. autostore operation the stk14c88-5 stores data to nvsram using one of three storage operations: 1. hardware store activated by hsb 2. software store activated by an address sequence 3. autostore on device power down autostore operation is a uni que feature of quantumtrap technology and is enabled by default on the stk14c88-5. during normal operation, the device draws current from v cc to charge a capacitor connected to the v cap pin. this stored charge is used by the chip to perform a single store operation. if the voltage on the v cc pin drops below v switch , the part automatically disconnects the v cap pin from v cc . a store operation is initiated with power provided by the v cap capacitor. figure 3 shows the proper connectio n of the storage capacitor (v cap ) for automatic store operation. a charge storage capacitor having a capacitor of between 68uf and 220uf (+ 20%) rated at 6v should be provided. the voltage on the v cap pin is driven to 5v by a charge pump internal to the chip. a pull up is placed on we to hold it inactive during power up. in system power mode, both v cc and v cap are connected to the +5v power supply without the 68 f capacitor. in this mode, the autostore function of the stk1 4c88-5 operates on the stored system charge as power goes do wn. the user must, however, guarantee that v cc does not drop below 3.6v during the 10 ms store cycle. to reduce unnecessary nonvolatile stores, autostore and hardware store operations are ignored, unless at least one write operation has taken place since the most recent store or recall cycle. software initiated store cycles are performed regardless of whether a write operation has taken place. an optional pull-up resist or is shown connected to hsb . the hsb signal is monitored by th e system to detect if an autostore cycle is in progress. if the power supply drops faster than 20 us/volt before vcc reaches v switch , then a 2.2 ohm resistor should be connected between v cc and the system supply to avoid momentary excess of current between v cc and v cap . autostore inhibit mode if an automatic store on power loss is not required, then v cc is tied to ground and + 5v is applied to v cap ( figure 4 ). this is the autostore inhibit mode, wh ere the autostore function is disabled. if the stk14c88-5 is operated in this configuration, references to v cc are changed to v cap throughout this data sheet. in this mode, store operations are triggered through software control or the hsb pin. to enable or disable autostore using an i/o port pin see ?? on page 5 . it is not permissible to change between these three options? on the fly?. figure 3. autostore mode [+] feedback stk14c88-5 document number: 001-51038 rev. ** page 4 of 17 hardware store (hsb ) operation the stk14c88-5 provides the hsb pin for controlling and acknowledging the store operations. the hsb pin is used to request a hardware stor e cycle. when the hsb pin is driven low, the stk14c88-5 conditionally initiates a store operation after t delay . an actual store cycle only begins if a write to the sram takes place since the last store or recall cycle. the hsb pin also acts as an open drain driver that is internally driven low to indicate a busy condition, while the store (initiated by any means) is in progress. pull up this pin with an external 10k ohm resistor to v cap if hsb is used as a driver. sram read and write operations, that are in progress when hsb is driven low by any means, are given time to complete before the store operation is initiated. after hsb goes low, the stk14c88-5 continues sram operations for t delay . during t delay , multiple sram read operations take place. if a write is in progress when hsb is pulled low, it allows a time, t delay to complete. however, any sram write cycles requested after hsb goes low are inhibited until hsb returns high. during any store operation, rega rdless of how it is initiated, the stk14c88-5 continues to drive the hsb pin low, releasing it only when the store is complete. after completing the store operation, the stk14c88-5 remains disabled until the hsb pin returns high. if hsb is not used, it is left unconnected. hardware recall (power up) during power up or after any low power condition (v cc < v reset ), an internal recall request is latched. when v cc once again exceeds the sense voltage of v switch , a recall cycle is automatically initiated and takes t hrecall to complete. if the stk14c88-5 is in a write state at the end of power up recall, the sram data is corrupted. to help avoid this situation, a 10 kohm resistor is connected either between we and system v cc or between ce and system v cc . software store data is transferred from the sr am to the nonvolatile memory by a software address sequence. the stk14c88-5 software store cycle is initiated by executing sequential ce controlled read cycles from six specific address locations in exact order. during the store cycle, an erase of the previous nonvolatile data is first performed followed by a program of the nonvolatile elements. when a store cycle is initiated, input and output are disabled until the cycle is completed. because a sequence of reads from specific addresses is used for store initiation, it is import ant that no other read or write accesses intervene in the sequence. if they intervene, the sequence is aborted and no store or recall takes place. to initiate the software store cycle, the following read sequence is performed: 1. read address 0x0e38, valid read 2. read address 0x31c7, valid read 3. read address 0x03e0, valid read 4. read address 0x3c1f, valid read 5. read address 0x303f, valid read 6. read address 0x0fc0, initiate store cycle the software sequence is clocked with ce controlled reads. when the sixth address in the sequence is entered, the store cycle commences and the chip is di sabled. it is important that read cycles and not write cycles are used in the sequence. it is not necessary that oe is low for a valid sequence. after the t store cycle time is fulfilled, the sram is again activated for read and write operation. software recall data is transferred from the nonvolatile memory to the sram by a software address sequence. a software recall cycle is initiated with a sequence of read operations in a manner similar to the software store initiation. to initiate the recall cycle, the following sequence of ce controlled read operations is performed: 1. read address 0x0e38, valid read 2. read address 0x31c7, valid read 3. read address 0x03e0, valid read 4. read address 0x3c1f, valid read 5. read address 0x303f, valid read 6. read address 0x0c63, initiate recall cycle internally, recall is a two step procedure. first, the sram data is cleared, and then the nonvolatile information is transferred into the sram cells. after the t recall cycle time, the sram is once again ready for read and write operations. the recall operation does not alter the data in the nonvolatile elements. the nonvolatile data can be recalled an unlimited number of times. figure 4. autostore inhibit mode [+] feedback stk14c88-5 document number: 001-51038 rev. ** page 5 of 17 data protection the stk14c88-5 protects data from corruption during low voltage conditions by inhibiting all externally initiated store and write operations. the low voltage condition is detected when v cc is less than v switch . if the stk14c88-5 is in a write mode (both ce and we are low) at power up after a recall or after a store, the write is inhibited until a negative transition on ce or we is detected. this protects against inadvertent writes during power up or brown out condi- tions. noise considerations the stk14c88-5 is a high speed memory. it must have a high frequency bypass capacitor of approximately 0.1 f connected between v cc and v ss, using leads and traces that are as short as possible. as with all high speed cmos ics, careful routing of power, ground, and signals reduce circuit noise. hardware protect the stk14c88-5 offers hardware protection against inadvertent store operation and sram writes during low voltage condi- tions. when v cap stk14c88-5 document number: 001-51038 rev. ** page 7 of 17 maximum ratings exceeding maximum ratings may shorten the useful life of the device. these user guidelines are not tested. storage temperature ................................. ?65 c to +150 c temperature under bias ............................. ?55 c to +125 c voltage on input relative to gnd.....................?0.5v to 7.0v voltage on input relative to vss............ ?0.6v to v cc + 0.5v voltage on dq 0-7 or hsb .......................?0.5v to vcc + 0.5v power dissipation.......................................................... 1.0w dc output current (1 output at a time, 1s duration) .... 15 ma operating range range ambient temperature v cc military -55 c to +125 c 4.5v to 5.5v dc electrical characteristics over the operating range (v cc = 4.5v to 5.5v) [6] parameter description test conditions min max unit i cc1 average v cc current t rc = 35 ns t rc = 45 ns dependent on output loading and cycle rate. values obtained without output loads. i out = 0 ma. 85 70 ma ma i cc2 average v cc current during store all inputs do not care, v cc = max average current for duration t store 3ma i cc3 average v cc current at t rc = 200 ns, 5v, 25c typical we > (v cc ? 0.2v). all other inputs cycling. dependent on output loading and cycle rate. values obtained without output loads. 10 ma i cc4 average v cap current during autostore cycle all inputs do not care, v cc = max average current for duration t store 2ma i sb1 [7] v cc standby current (standby, cycling ttl input levels) t rc = 35 ns, ce > v ih t rc = 45 ns, ce > v ih 26 23 ma ma i sb2 [7] v cc standby current ce > (v cc ? 0.2v). all others v in < 0.2v or > (v cc ? 0.2v). standby current level after nonvolatile cycle is complete. inputs are static. f = 0 mhz. 1.5 ma i ix input leakage current v cc = max, v ss < v in < v cc -1 +1 a i oz off state output leakage current v cc = max, v ss < v in < v cc , ce or oe > v ih or we < v il -5 +5 a v ih input high voltage 2.2 v cc + 0.5 v v il input low voltage v ss ? 0.5 0.8 v v oh output high voltage i out = ?4 ma 2.4 v v ol output low voltage i out = 8 ma 0.4 v v bl logic ?0? voltage on hsb output i out = 3 ma 0.4 v v cap storage capacitor between v cap pin and vss, 6v rated. 68 f + 20% nom. 54 260 uf data retention and endurance parameter description min unit data r data retention 100 years nv c nonvolatile store operations 1,000 k notes 6. v cc reference levels throughout this data sheet refer to v cc if that is where the power s upply connection is made, or v cap if v cc is connected to ground. 7. ce > v ih does not produce standby current levels until any nonvolatile cycle in progress has timed out. [+] feedback stk14c88-5 document number: 001-51038 rev. ** page 8 of 17 capacitance in the following table, the capacitance parameters are listed. [8] parameter description test conditions max unit c in input capacitance t a = 25 c, f = 1 mhz, v cc = 0 to 3.0v 5pf c out output capacitance 7pf thermal resistance in the following table, the thermal resistance parameters are listed. [8] parameter description test conditions 32-cdip 32-lcc unit ja thermal resistance (junction to ambient) test conditions follow standard test methods and procedures for measuring thermal impedance, per eia / jesd51. tbd tbd c/w jc thermal resistance (junction to case) tbd tbd c/w figure 7. ac test loads ac test conditions 5.0v output 30 pf r1 963 r2 512 5.0v output 5 pf r1 963 r2 512 for tri-state specs input pulse levels .................................................... 0v to 3v input rise and fall times (10% - 90%)........................ < 5 ns input and output timing referenc e levels ...... .............. 1.5v note 8. these parameters are guaranteed by design and are not tested. [+] feedback stk14c88-5 document number: 001-51038 rev. ** page 9 of 17 ac switching characteristics sram read cycle parameter description 35 ns 45 ns unit min max min max cypress parameter alt t ace t elqv chip enable access time 35 45 ns t rc [9] t avav, t eleh read cycle time 35 45 ns t aa [10] t avqv address access time 35 45 ns t doe t glqv output enable to data valid 15 20 ns t oha [10] t axqx output hold after address change 5 5 ns t lzce [11] t elqx chip enable to output active 5 5 ns t hzce [11] t ehqz chip disable to output inactive 13 15 ns t lzoe [11] t glqx output enable to output active 0 0 ns t hzoe [11] t ghqz output disable to output inactive 13 15 ns t pu [8] t elicch chip enable to power active 0 0 ns t pd [8] t ehiccl chip disable to power standby 35 45 ns switching waveforms figure 8. sram read cycle 1: address controlled [9, 10] figure 9. sram read cycle 2: ce and oe controlled [9] w 5 & w $ $ w 2 + $ $ ' ' 5 ( 6 6 ' 4 ' $ 7 $ 2 8 7 ' $ 7 $ 9 $ / , ' $ ' ' 5 ( 6 6 w 5 & & |